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| SHINDENGEN General Purpose Rectifiers UL Bridges U6SB60 600V 6A FEATURES *oe Single In-Line Package Thin *oe Recognized UL (UL File No.E142422) *oe High IFSM *oe Applicable to Automatic Insertion APPLICATION OUTLINE DIMENSIONS Case : 3S Case : 5S (Unit : mm) *oe power supply Switching *oe Home Appliances, Office Equipment *oe Telecommunication, Factory Automation RATINGS *oeAbsolute Maximum Ratings (If not specified Tc=25*Z) Item Symbol Conditions Ratings Unit Tstg -40*150 *Z Storage Temperature Tj 150 *Z Operating Junction Temperature V 600 V Maximum Reverse Voltage RM Average Rectified ForwardICurrent sine wave, R-load With heatsink Tc=111*Z 6 A O 50Hz 50Hz sine wave, R-load*@ Without heatsink Ta=25*Z 2.8 I 1 A Peak Surge Forward Current 50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25*Z70 FSM I2 2ms*...t*10ms*@Tj=25*Z t 140 A2 s Current Squared Time Dielectric Strength Vdis Terminals to case, AC 1 minute 2 kV N Mounting Torque TOR * ecommended torque : 0.5Nm*j R i 0.8 m *oeElectrical Characteristics (If not specified Tc=25*Z) Item Symbol Conditions V I =3A, Pulse measurement, Rating of per diode Forward Voltage F F IR V=V , Pulse measurement, Rating of per diode Reverse Current R RM AEjcjunction to case *@*@With heatsink AEjljunction to lead *@*@ Without heatsink Thermal Resistance AEjajunction to ambient Without heatsink Ratings Unit Max.1.05 V Max.10 EA Max.3.4 Max.5 *Z/W Max.26 Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd U6SBx 100 Forward Voltage 10 Forward Current IF [A] Tl=150C [TYP] Tl=25C [TYP] 1 Pulse measurement per diode 0.1 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 Forward Voltage VF [V] U6SBx 14 Forward Power Dissipation SIN Forward Power Dissipation PF [W] 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7 Average Rectified Forward Current IO [A] Tj= 150C Sine wave U6SBx 14 Derating Curve Average Rectified Forward Current IO [A] 12 PCB 10 Glass-epoxy substrate Soldering land 5mm 8 6 4 2 0 80 90 100 110 120 130 140 150 Case Temperature Tc [C] Sine wave R-load Free in air U6SBx 6 Derating Curve Average Rectified Forward Current IO [A] 5 PCB Glass-epoxy substrate Soldering land 5mm 4 3 2 1 0 0 20 40 60 80 100 120 140 160 Ambient Temperature Ta [C] Sine wave R-load Free in air U6SBx 350 Peak Surge Forward Capability IFSM 10ms 10ms 300 1 cycle Peak Surge Forward Current IFSM [A] non-repetitive, sine wave, Tj=25C before surge current is applied 250 200 150 100 50 0 1 2 5 10 20 50 100 Number of Cycles [cycles] |
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